< a href="https://www.maximizemarketresearch.com/market-report/global-high-density-interconnect-hdi-pcb-market/30122/"> Global High-Density Interconnect (HDI) PCB Market </a> was valued US$ 9.58Bn in 2017 and is expected to reach US$ 23.53 Bn by 2026 at a CAGR of 11.89% during the forecast period.
Global High-Density Interconnect (HDI) PCB Market
The factors that drive the global HDI PCB market include miniaturization of size and lower weight, high efficiency, and growing sales of consumer electronics. In addition, increase in utilization of HDI technology in automobiles is expected to provide lucrative growth opportunities for the market. On the other hand, high construction cost is expected to restrain the growth of the global market.
The growing sales of consumer electronics and a substantial rise in the demand for HDI PCBs in these applications are driving the growth of the global HDI PCB market. Therefore, the consumer electronics industry is becoming one of the important end-user markets for high-density technology. Currently, application of these boards in consumer electronic devices like smartphones, smart wearables, gaming consoles, tablets, and others are significant. Thereby with increasing demand and production of these devices, the global HDI PCB market is projected to grow in the forecast period.
The HDI market for smart wearable devices is projected to grow at the highest CAGR during the forecast period. HDI PCBs possess technical features of extremely high density routing interconnections and make the high density of components possible. These attributes contribute to the high performance and lightweight of HDI boards that make them ideal for powering wearable devices.
Asia Pacific expectedto account for the major share of the global HDI market in during the forecast period. This growth can be attributed to the growing application of HDI in consumer electronics, automotive, and healthcare verticals in countries like China, India. It is also because of the extension of telecommunications networks in China, South Korea, India, and other developing countries in Asia Pacific.
The company believes in providing leading-edge products for the growth of HDI PCB market. Its goal is to build its core competency based on technology innovation and intellectual properties. For this purpose, Unimicron has developed partnerships with Tier 1 materials and equipment suppliers. The company participates in product and technology development projects in domestic and international research institutes; there are cooperative projects with research institutes like IZM (Germany) and Georgia Institute of Technology.
This study presents an analytical depiction of the global HDI PCB market along with the current trends and future estimations to depict the imminent investment pockets. The overall market potential is determined to understand the profitable trends to gain a strong foothold in the market.
The objective of the report is to present a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, industry-validated market data and projections with a suitable set of assumptions and methodology. The report also helps in understanding dynamics, structure by analyzing the market segments By End User, power rate, application and region and, project the global market size. The report also provides a clear representation of competitive analysis of key players by product, price, financial position, product portfolio, growth strategies, and regional presence in the High-Density Interconnect (HDI) PCB market. The report also provides PEST analysis, PORTER’s analysis, SWOT analysis to address the question of shareholders in arranging the efforts and investment in the near future to a particular market segment.
Scope of Global High-Density Interconnect (HDI) PCB Market
Global High-Density Interconnect (HDI) PCBMarket, By End User
• Consumer Electronics
• Automotive
• Industrial Electronics
• IT & Telecommunications
• Others
Global High-Density Interconnect (HDI) PCBMarket, By Application
• Smartphone & Tablet
• Laptop & PC
• Smart Wearables
• Others
Global High-Density Interconnect (HDI) PCBMarket, By Region
• North America
• Europe
• Asia Pacific
• Middle East & Africa
• South America
Key players operating in Global High-Density Interconnect (HDI) PCB Market
• PCBCART
• Millennium Circuits Limited
• RAYMING
• Mistral Solutions Pvt. Ltd.
• SIERRA CIRCUITS, INC.
• Advanced Circuits
• FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
• FINELINE Ltd.
• Austria Technologie&SystemtechnikAktiengesellschaft
• Siemens AG
• Compeq Manufacturing Co. Ltd.
• TTM Technologies, Inc.
• Unimicron
• AT&S
• Ibiden Group
• SEMCO
• Unitech Printed Circuit Board Corp.
• Tripod Technology Corp.
• DAP Corporation
• Meiko Electronics Co. Ltd.
Market SynopsisMarket Research Future (MRFR), in its latest report on the Globally, the High-Density Interconnect (HDI) Printed Circuit Board (PCB) Market 2020, states major factors that are expected to boost the expansion of the market across the study period.
An in-depth analysis of the impact of coronavirus outbreak on the high density interconnect PCB market is provided along with the report.
As per MRFR analysis, the worldwide market of High Density Interconnect PCB is expected to rise at 12.4% CAGR across the analysis period 2020–2027.
High Density Interconnect PCB value can touch USD 15,600.6 Mn from USD 8,683.9 Mn in 2020 to 2027.The growing awareness about the higher circuitry density of HDI PCB over traditional PCB that allows designers to fit more components on an HDI PCB is expected to underpin the expansion of the market in the years to come.
Features, such as shorter distance between electronic components and their compactness aid in the reduction of signal loss and crossing delays that result in the rapid transmission of signals.
The industry vertical based segments of the High Density Interconnect PCB Market are military and defense, consumer electronics, automotive, telecom and IT, medical devices, manufacturing, and others.
Expired PCB may cause oxidation of the solder pad on the PCB surfaceOxidation of the soldering pad will cause poor soldering, which may eventually lead to the failure of the PCB function or the risk of dropping parts.
Different surface treatments of circuit boards will have different anti-oxidation effects.
In principle, ENIG requires it to be used up within 12 months, while OSP requires it to be used up within six months.
It is recommended to follow the shelf life of the PCB board factory.
OSP boards can generally be sent back to the board factory to wash off the OSP film and re-apply a new layer of OSP, but there is a chance that the copper foil circuit will be damaged when the OSP is removed by pickling, so it is best to contact the board factory to confirm whether the OSP film can be reprocessed.
ENIG boards cannot be reprocessed.
