Lasers have been proven to be versatile industrial tools, providing robust and reliable performance that is effective for a wide range of industrial applications beyond those mentioned in any article. And the new UV picosecond lasers are especially beneficial for the precise, small feature sizes.
The combination of fast picosecond pulses, excellent pulse-to-pulse consistency, and high levels of repetition produces precise cuts and patterns with smooth, clean edges, and sometimes without post-process cleaning. As an alternative to current laser and non-laser methods, picosecond laser is gaining market share in emerging applications.
Picosecond laser micromachining for the medical industry: Bioabsorbable stent cutting
In the U.S. alone, over half a million stents are used to open blood vessels each year. Restenosis was one complication of early, all-metal stents, where plaques grow on the stent, re-blocking the opened blood vessel. In response, stent manufacturers produced the second generation of stents, which were coated with an anti-restenosis drug containing a bioabsorbable material. This medication slowly fuses on-site as the coating dissolves over months.
However, there are still potential long-term, post-operative complications with these stents. So bioabsorbable materials have been produced, which entirely disappear after the critical months after vessel opening has given a support system. The polymers utilized in such stents must be strong enough to withstand physical stress inside the body, and many types of bioabsorbable materials already exist which meet this criterion.
To produce the stent structure and provide the appropriate smooth surface finish, extremely high precision (< 20 μm) is necessary, making the laser a suitable option for this mission. The increased optical absorption available at deep UV wavelengths means lasers were a popular choice for polymers with micromachining. An emerging alternative approach is to use picosecond-focused UV (355 nm) pulses at a small spot size(~10 μm), which promotes higher optical absorption in a small localized area.
Why Choose Laserod Technologies
Laserod is dedicated to providing exceptional micromachining services to a variety of industries, including Medical, Aerospace, Solar cell, Touch screen fabricators, and others. Laserod’s specialties range from drilling and cutting thin materials to circuit patterning on displays and everything in between. Whatever the project may be, Laserod Technologies is always ready for it. So contact one of our experts at 310-340-1343/ 888-991-9916 to see if we can help.
The importance of lasers has grown by leaps and bounds ever since its invention.
Not only can lasers cut easily, but they can do so with precision and efficiency in speed, all for a minimal cost.
Laser cutters have replaced various other kinds of cutters that were available before their invention, and their demand has been growing every year with the growth in the number of laser cutting jobs.Laser cutting jobs are flexible, and from fragile materials such as cloth, plastic, and paper to other more robust materials such as wood, metal, and stainless steel, practically anything can be cut using a laser.
Perhaps best of all, most of the laser cutting jobs on high-quality, precision laser cutting systems take no time and involve minimal human intervention.The various benefits offered by lasers have led to their use in different laser cutting jobs.
Because lasers use a non-contact manner of cutting things, there is no mechanical pressure on the piece being cut, thus reducing the instrument's chances of wear and tear.The hardness of the material being cut does not affect the laser instrument.
The cutting has high degrees of automation and flexibility and offers ease of integration with other automated systems.
Global Thin Wafer Processing and Dicing Equipment Market 2018-2023:Global Thin Wafer Processing and Dicing Equipment market size will grow from in 2017 to by 2023, at an estimated CAGR of .
Get Sample Copy of Global Thin Wafer Processing and Dicing Equipment Market @ http://orbisresearch.com/contacts/request-sample/2201078 By Market Players: Suzhou Delphi Laser Co. Ltd., SPTS Technologies Ltd., Advanced Dicing Technologies , Tokyo Electron Ltd., Plasma-Therm, LLC , DISCO Corporation, Lam Research Corporation , EV Group , Tokyo Seimitsu Co. Ltd., Panasonic Corporation By Application Logic and Memory, MEMS (Micro Electro Mechanical Systems), Power Device, RFID (Radio Frequency Identification), CMOS Image Sensor By Dicing Technology Blade Dicing, Laser Dicing, Plasma Dicing By Wafer Thickness 750 ?m, 120 ?m, 50 ?m The prime objective of this report is to help the user understand the market in terms of its definition, segmentation, market potential, influential trends, and the challenges that the market is facing.
The readers will find this report very helpful in understanding the market in depth.
Points Covered in The Report: The points that are discussed within the report are the major market players that are involved in the market such as manufacturers, raw material suppliers, equipment suppliers, end users, traders, distributors and etc.
Finally, the report contains the conclusion part where the opinions of the industrial experts are included.
To understand the most affecting driving and restraining forces in the market and its impact in the global market.
Rising demand for three dimensional integrated circuit used extensively across various miniature semiconductor devices is one of the important factor anticipated to boost the demand for thin wafer processing and dicing equipment in the coming years.
Three dimensional integrated circuit are increasingly adopted across various space constrained applications including portable consumer electronic devices, sensors, MEMS and industrial products as it increases the overall performance of the products in terms of speed, durability, low power consumption, light weight and memory.
Thin wafer of thickness 20 um – 50 um is an integral part of the three dimensional integrated circuit technology.
Thus, anticipated increasing demand for three dimensional integrated circuit in turn is predicted to boost the demand for thin wafer processing equipment during the forecast period from 2018 - 2025.The report also provides assessment of different drivers that is impacting the global market, along with the restraints and opportunities that are anticipated to affect the demand of thin wafer processing and dicing equipment in the coming years.
Moreover, after taking into consideration all this factors, an extensive analysis of the region wise growth parameters of thin wafer processing and dicing equipment market along with the overall assessment during the forecast period of 2018 - 2025 has been also been furnished within this report.
Moreover, various wafer thinning and packaging constraints coupled with advanced packaging trend that are anticipated to affect the demand of the thin wafer processing and dicing equipment is also covered within our scope of research.Request For Report Sample: https://www.trendsmarketresearch.com/report/sample/3569Some of the major players operating the thin wafer processing and dicing equipment market includes Disco Corporation (Japan), Plasma Therm LLC (USA), Tokyo Electron Ltd (Japan) and EV Group (Austria) among others.For the purpose of providing an exhaustive analysis of the thin wafer processing and dicing equipment market across the globe, the market has been segmented on the basis of application, dicing technology, wafer size and geography.
Wafer Dicing Saws Market Insights 2019, Global and Chinese Scenario is a professional and in-depth study on the current state of the global Wafer Dicing Saws industry with a focus on the Chinese market.
The report provides key statistics on the market status of the Wafer Dicing Saws manufacturers and is a valuable source of guidance and direction for companies and individuals interested in the industry.Overall, the report provides an in-depth insight of 2014–2024 global and Chinese Wafer Dicing Saws market covering all important parameters.The key ponits of the report:The report provides a basic overview of the industry including its definition, applications and manufacturing technology.The report explores the international and Chinese major industry players in detail.
In this part, the report presents the company profile, product specifications, capacity, production value, and 2014–2019 market shares for each company.Through the statistical analysis, the report depicts the global and Chinese total market of Wafer Dicing Saws industry including capacity, production, production value, cost/profit, supply/demand and Chinese import/export.The total market is further divided by company, by country, and by application/type for the competitive landscape analysis.The report then estimates 2019–2024 market development trends of Wafer Dicing Saws industry.
Analysis of upstream raw materials, downstream demand, and current market dynamics is also carried out.The report makes some important proposals for a new project of Wafer Dicing Saws Industry before evaluating its feasibility.Key Questions Addressed by the ReportWhat is the growth perspective of the Wafer Dicing Saws Market and the key dynamics and trends governing the market?What are key sustainability strategies adopted by the leading players in the Wafer Dicing Saws Market?What are the new and emerging technologies and use cases disrupting the Wafer Dicing Saws industry?What are the key applications where Wafer Dicing Saws plays a significant role?Report Sample includes:- Table of Contents- List of Tables & Figures- Charts- Research MethodologyGet FREE Sample of this Report at https://www.24marketreports.com/report-sample/global-wafer-dicing-saws-2019-2024-315There are 3 key segments covered in this report: competitor segment, product type segment, end use/application segment.For competitor segment, the report includes global key players of Wafer Dicing Saws as well as some small players.
At least 6 companies are included:DISCO CorporationTOKYO SEIMITSUAdvanced Dicing TechnologyDynatex InternationalLoadpointMicross ComponentsThe information for each competitor includes:Company ProfileMain Business InformationSWOT AnalysisSales, Revenue, Price and Gross MarginMarket ShareFor product type segment, this report listed main product type of Wafer Dicing Saws market in gloabal and china.BGAQFNLTCCFor end use/application segment, this report focuses on the status and outlook for key applications.
End users sre also listed.Integrated Equipment ManufacturersPureplay FoundriesReasons to Purchase this Report:Estimates 2019–2024 Wafer Dicing Saws market development trends with the recent trends and SWOT analysisMarket dynamics scenario, along with growth opportunities of the market in the years to comeMarket segmentation analysis including qualitative and quantitative research incorporating the impact of economic and policy aspectsRegional and country level analysis integrating the demand and supply forces that are influencing the growth of the market.Market value (USD Million) and volume (Units Million) data for each segment and sub-segmentCompetitive landscape involving the market share of major players, along with the new projects and strategies adopted by players in the past five yearsComprehensive company profiles covering the product offerings, key financial information, recent developments, SWOT analysis, and strategies employed by the major market players1-year analyst support, along with the data support in excel format.Any special requirements about this report, please let us know and we can provide custom report.The report delivers a comprehensive overview of the crucial elements of the market and elements such as drivers, restraints, current trends of the past and present times, supervisory scenario, and technological growth.
