Chip on flex is popular by its abbreviation COF in the electrical industry. Since its discovery, getting a flexible circuit has been a possibility. In the past few years, the electrical sector has underwent a whole lot of changes. It has seen a lot of novel product launches, one of the most important ones has been the introduction of chip on flex. Lately, majority of the electrical businesses out there have started utilizing it. Resultantly, the global chip on flex market is has gained traction.
For the uninitiated a chip on flex is a semiconductor which forms an integral part of a flexible circuit. It is a technology in which the microchip or the die is directly attached on and electrically aligned to a flexible circuit. A flexible circuit can be explained as an electric field wherein the entire system has been placed on a flexible substrate in place of a conventional circuit board. Therefore, when it comes to a COF assembly, the microchip need not undergo the assembly steps that are needed for individual IC packaging.
The most important advantage of using this semiconductor is that it makes the manufacturing process quite easy and convenient. This is one of the major reasons why most of the enterprise owners are turning towards these semiconductors.
Market Synopsis
Currently, the electrical sector is in the stage of technological reformation. Owing to this fact, it can be positively concluded that the future seems pretty bright for the chip on flex market. When it comes to revenue, the market is expected to earn above USD 1794.65 million by the end of the forecast period which is 2018-2022. Moreover, in terms of CAGR the market is projected to move forward at the rate of 4.40%.
There are many growth factors that are responsible for the development and growth of the market. The requirement for smaller and compact flexible electronic systems for various devices like radio frequency, displays, biomedical implants, sensors and lighting happens to be a chief growth factor for the market.
In addition to these, recent technological innovations that have brought about improvements like much more accurate designs and automated production can be termed as a secondary growth driver for the industry.
Although, the market may face certain obstacles like expensiveness of raw materials and changing requirements of the customers. However, experts believe that with time these issues can be effectively resolved.
Competitive Analysis
The augmented variation in the market companies has laid down a stable basis for the development of the market. The necessity to alleviate risks is estimated to affect progress in the market in its entirety. The comparative simplicity in acquiring financing is anticipated to channel the advancement of the market in the forthcoming period. The administrations around the world are also playing a part in ensuring the exceptional progress of the market. The organizing of international economies has additionally intensified the growth of the market. The developments in the manufacturing value are generating a vigorous atmosphere for the expansion of the market. The consolidation of the distribution channels is projected to generate added stimulus of the market’s evolution. The promotion of contemporary systems in the manufacture and retailing of the goods is inspiring the market in the direction of fulfilling its goals.
The well-known competitors in the market of chip on flex market are Stemko Group(Korea), LGIT Corporation (U.S.), Flexceed (Japan), Chipbond Technology Corporation (Taiwan), CWE (Taiwan), Danbond Technology Co. Ltd.(China), Compass Technology Company Limited (Hong Kong), AKM Industrial Company Ltd.(China), Compunetics (U.S.), and Stars Microelectronics Public Company Ltd (Thailand) among others.
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Chip On Flex Market report added by Value Market Research, offering growth, trends, and forecast for each segment along with regional and country analysis.
Further, this report also highlights the regional and country-level market analysis.The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide.
The major players in the chip on flex market include AKM INDUSTRIAL COMPANY LIMITED, Chipbond Technology Corporation, Compass Technology Company Limited, Compunetics, Inc., FLEXCEED Co., Ltd., LG INNOTEK, Shenzhen Danbang Technology Co., Ltd., Stars Microelectronics (Thailand) PCL., and other.
This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.Get more information on "Global Chip On Flex Market Research Report" by requesting FREE Sample Copy at https://www.valuemarketresearch.com/contact/chip-on-flex-market/download-sampleMarket DynamicsThe market is mainly driven by rising investment in R to create an advanced flexible display in the market.
Further, the growing demand for small and flexible electronics critical to many devices such as displays, sensors, lighting, biomedical implants, and radio frequency identification, which require automated manufacture with highly accurate performance, is expected to drive the growth of the market.
Moreover, with the use of these chips, industries ensure increased accuracy with reduced error cost and improved product quality with testing repeatability.
Global Chip on Flex Market, By Type (Single Sided Chip On Flex, Others), By Application (Static, Dynamic), By Verticals (Military, Medical, Aerospace, Electronics) - Forecast 2021Chip On Flex MarketChip On Flex Market is expected to grow at CAGR of ~4.43% during the forecast period and expected to reach market size of US ~$1795 Million by the end of forecast period.
Chip On Flex is also known as direct chip attachment.
Chip On Flex possess high bending strength, which makes it useful in processes that require bending and folding.
It is also used in electronic equipment which requires repeated movements such as printers.The other advantages provided by Chip On Flex technology include savings in space, mechanical flexibility, low production cost and increased reliability from heat distribution.
The market is majorly driven by growing range of applications in the industrial, military, computer, telecommunication, consumer electronics, and medical electronics industries.
The increasing collaboration between printed circuit board companies and funding by government bodies also ensures the prevalence of flexible printed circuit board in consumer electronics, automotive, aerospace, defense, Medical as well as other applications.Unlike rigid boards, flex circuits are not restricted to two dimensions.
This report studies the global Chip-On-Flex market status and forecast, categorizes the global Chip-On-Flex market size (value & volume) by manufacturers, type, application, and region.
This report focuses on the top manufacturers in United States, Europe, China, Japan, South Korea and Taiwan and other regions.
Download Free Sample Report @ https://www.radiantinsights.com/research/global-chip-on-flex-market-research-report-2018/request-sample The major manufacturers covered in this report • Stemko Group• Chipbond Technology Corporation• Danbond Technology Co• Compass Technology Company Limited• Stars Microelectronics Public Company Ltd• LGIT Corporation• Flexceed• CWE• AKM Industrial Company Ltd• Compunetics Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering• North America• Europe• China• Japan• Southeast Asia• India Browse Full Research Report with TOC @ https://www.radiantinsights.com/research/global-chip-on-flex-market-research-report-2018 We can also provide the customized separate regional or country-level reports, for the following regions:• North America• United States• Canada• Mexico• Asia-Pacific• China• India• Japan• South Korea• Australia• Indonesia• Singapore• Rest of Asia-Pacific• Europe• Germany• France• UK• Italy• Spain• Russia• Rest of Europe• Central & South America• Brazil• Argentina• Rest of South America• Middle East & Africa• Saudi Arabia• Turkey• Rest of Middle East & Africa On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into• Single Sided Chip on Flex• Other TypesOn the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including• Medical• Electronics• Military• Others The study objectives of this report are:• To analyze and study the global Chip-On-Flex capacity, production, value, consumption, status (2013-2017) and forecast (2018-2025);• Focuses on the key Chip-On-Flex manufacturers, to study the capacity, production, value, market share and development plans in future.• Focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.• To define, describe and forecast the market by type, application and region.• To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.• To identify significant trends and factors driving or inhibiting the market growth.• To analyze the opportunities in the market for stakeholders by identifying the high growth segments.• To strategically analyze each submarket with respect to individual growth trend and their contribution to the market• To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market• To strategically profile the key players and comprehensively analyze their growth strategies.
Read all Reports of this category @ https://www.radiantinsights.com/catalog/electronics About Radiant Insights Radiant Insights is a platform for companies looking to meet their market research and business intelligence requirements.
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