Chip On Flex Market
Chip on Flex is a very interesting and promising interconnection method that are used especially in portable electronic products such as mobile phones, portable terminals, and digital cameras and among others. In the process of Chip on Flex, integrated circuits (IC) are normally connected using anisotropically conductive adhesive. Various technological progression to increase the accuracy and development of cost effective flexible printed boards are major driving factors for the growth of the Chip On Flex market.
Growing demand of Smartphone has made the significant growth in flexible printed circuit board industry. This is due to increasing global demand for mobile phones in recent years which led to substantial demand for flexible circuits. However, consumer electronics is expected to emerge as the fastest growing end-use market for flexible printed circuits worldwide. The physical characteristics of flexible printed circuit boards such as lesser thickness, lesser weight, and the ability to take any forms, besides these reliability and functionality will contribute towards the growth of this market.
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According to Market Research Future Analysis, Global chip on flex market has been valued at US $ ~1795 Million by the end of forecast period with CAGR of ~4.43% during forecast period 2016 to 2021.
Market Research Future (MRFR) recognizes the following companies as the key players in the Global chip on flex Market: – LGIT corporation (U.S.), Stemko Group (Korea), Flexceed (Japan), Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond Technology Co. Ltd.(China), AKM Industrial Company Ltd.(China), Compass Technology Company Limited (Hong Kong), Compunetics Inc. (U.S.) and Stars Microelectronics Company Ltd (Thailand) and among others.
Commenting on the report, an analyst from Market Research Future (MRFR)’s team said:
“Among all verticals of chip on flex, electronics is expected to grow the highest. Chip on Flex (COF) is used in various electronics, such as telephone, LCD driver IC, LED, Laptop, etc. It maximizes the performance of driver-IC to achieve sharp images. It is suitable for next-generation flexible/wearable displays and enables the implementation of ultra-thin, narrow bezels. The growing demand of semiconductor and component test equipment is also influenced by the change and development in semiconductor and electronic component technology. With the growing demand of semiconductor and electronic parts which are small in size, incorporates more function and require less energy to operate and driven by the continuous improvement in the personal computers such as flat TV’s, DVD/ Blu-ray recorders, digital camera, mobile handsets, gaming consoles and many more.”
Market Research Future Analysis shows that Asia pacific is forecasted to dominate the market owing to presence of major COF manufactures in China. China is also the biggest consumption market of chip on flex. The growth in Asia pacific region can also be attributed to stable growth of Taiwan economy owing to its economic structure and bureaucratic system. Europe will experience a growth in chip on flex market owing to huge number of automobile industries in the region. With the increasing demand of high quality automobiles in the North America region, the manufacturers have started focusing on the adaption of high quality manufacturing techniques and quality assurance procedures. Europe will experience a consistent growth in the forecast period and will contribute approximately 27% in the global chip on flex revenue market.
The Global chip on flex Market has been segmented on the basis of types, applications and verticals. The types of chip on flex are one sided chip on flex and others. The applications comprises of static and dynamic flexing. The various verticals of chip on flex market are military, medical, aerospace, electronics and others.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Related Article@ https://www.openpr.com/news/2092580/chip-on-flex-market-sars-cov-2-covid-19-analysis-share
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Chip On Flex Market report added by Value Market Research, offering growth, trends, and forecast for each segment along with regional and country analysis.
Further, this report also highlights the regional and country-level market analysis.The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide.
The major players in the chip on flex market include AKM INDUSTRIAL COMPANY LIMITED, Chipbond Technology Corporation, Compass Technology Company Limited, Compunetics, Inc., FLEXCEED Co., Ltd., LG INNOTEK, Shenzhen Danbang Technology Co., Ltd., Stars Microelectronics (Thailand) PCL., and other.
This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.Get more information on "Global Chip On Flex Market Research Report" by requesting FREE Sample Copy at https://www.valuemarketresearch.com/contact/chip-on-flex-market/download-sampleMarket DynamicsThe market is mainly driven by rising investment in R to create an advanced flexible display in the market.
Further, the growing demand for small and flexible electronics critical to many devices such as displays, sensors, lighting, biomedical implants, and radio frequency identification, which require automated manufacture with highly accurate performance, is expected to drive the growth of the market.
Moreover, with the use of these chips, industries ensure increased accuracy with reduced error cost and improved product quality with testing repeatability.
Chip on flex has some important features such as heat sinks, component assembly, penalization, shielding, over molding and graphic overlay among others which makes it more acceptable among end users such as electronic industry, aerospace, defense and others.
The major drivers for the growth of this market are increasing need for small and flexible electronics in various applications such as displays, sensors, lighting, biomedical implants, and radio frequency identification among others and the rapid technological advancements which lead to accurate designs and automated production, of flex circuits that helps to eliminate human errors once involved in hand-built wire harnesses.
With the use of these flexible circuit board companies ensure the 100% efficiency in the products, due to which level of fault ratio is drastically reduced.
Chip on flex helps in reducing the cost, improving operator ergonomics, amplified product quality and testing repeatability.The Global Chip on Flex Market is expected to grow from US ~$1437 Million in 2016 to US~$ 1795 Million by 2021, at an estimated CAGR of 4.43%.
The growth of this market can be constrained by the increased cost of raw materials in related industries like the electronic industry along with the wide variety of technology used and the consumer needs changing to efficient, cheaper and powerful consumer electronics and mobile technologies.Key Players The prominent players in the market of chip on flex market are – LGIT corporation (U.S.), Stemko group(Korea), Flexceed(Japan) , Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond technology co. ltd.(China), AKM industrial company ltd.(China), compass technology company limited(Hong Kong), Compunetics(U.S.), and Stars microelectronics public company ltd (Thailand) among others.Get Sample of Report @ https://www.marketresearchfuture.com/sample_request/2015Segments:The Global chip on flex Market has been segmented on the basis of types, applications and verticals.
The various verticals of chip on flex market are military, medical, aerospace, electronics and others.Key Finding:The Global Chip on Flex Market is expected to reach USD 1795 million by 2021.Europe accounts for the largest market share and is growing with a market share of USD 494 million during forecast period.China accounts highest production capacity in the year 2016Global Chip on flex is segmented by type that includes single sided COF and Others.
Global Chip on Flex Market, By Type (Single Sided Chip On Flex, Others), By Application (Static, Dynamic), By Verticals (Military, Medical, Aerospace, Electronics) - Forecast 2021Chip On Flex MarketChip On Flex Market is expected to grow at CAGR of ~4.43% during the forecast period and expected to reach market size of US ~$1795 Million by the end of forecast period.
Chip On Flex is also known as direct chip attachment.
Chip On Flex possess high bending strength, which makes it useful in processes that require bending and folding.
It is also used in electronic equipment which requires repeated movements such as printers.The other advantages provided by Chip On Flex technology include savings in space, mechanical flexibility, low production cost and increased reliability from heat distribution.
The market is majorly driven by growing range of applications in the industrial, military, computer, telecommunication, consumer electronics, and medical electronics industries.
The increasing collaboration between printed circuit board companies and funding by government bodies also ensures the prevalence of flexible printed circuit board in consumer electronics, automotive, aerospace, defense, Medical as well as other applications.Unlike rigid boards, flex circuits are not restricted to two dimensions.
Chip-On-Flex MarketChip on flex is popular by its abbreviation COF in the electrical industry.
In the past few years, the electrical sector has underwent a whole lot of changes.
Lately, majority of the electrical businesses out there have started utilizing it.
Resultantly, the global chip on flex market is has gained traction.For the uninitiated a chip on flex is a semiconductor which forms an integral part of a flexible circuit.
This is one of the major reasons why most of the enterprise owners are turning towards these semiconductors.Market SynopsisCurrently, the electrical sector is in the stage of technological reformation.
Owing to this fact, it can be positively concluded that the future seems pretty bright for the chip on flex market.
This report studies the global Chip-On-Flex market status and forecast, categorizes the global Chip-On-Flex market size (value & volume) by manufacturers, type, application, and region.
This report focuses on the top manufacturers in United States, Europe, China, Japan, South Korea and Taiwan and other regions.
Download Free Sample Report @ https://www.radiantinsights.com/research/global-chip-on-flex-market-research-report-2018/request-sample The major manufacturers covered in this report • Stemko Group• Chipbond Technology Corporation• Danbond Technology Co• Compass Technology Company Limited• Stars Microelectronics Public Company Ltd• LGIT Corporation• Flexceed• CWE• AKM Industrial Company Ltd• Compunetics Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering• North America• Europe• China• Japan• Southeast Asia• India Browse Full Research Report with TOC @ https://www.radiantinsights.com/research/global-chip-on-flex-market-research-report-2018 We can also provide the customized separate regional or country-level reports, for the following regions:• North America• United States• Canada• Mexico• Asia-Pacific• China• India• Japan• South Korea• Australia• Indonesia• Singapore• Rest of Asia-Pacific• Europe• Germany• France• UK• Italy• Spain• Russia• Rest of Europe• Central & South America• Brazil• Argentina• Rest of South America• Middle East & Africa• Saudi Arabia• Turkey• Rest of Middle East & Africa On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into• Single Sided Chip on Flex• Other TypesOn the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including• Medical• Electronics• Military• Others The study objectives of this report are:• To analyze and study the global Chip-On-Flex capacity, production, value, consumption, status (2013-2017) and forecast (2018-2025);• Focuses on the key Chip-On-Flex manufacturers, to study the capacity, production, value, market share and development plans in future.• Focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.• To define, describe and forecast the market by type, application and region.• To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.• To identify significant trends and factors driving or inhibiting the market growth.• To analyze the opportunities in the market for stakeholders by identifying the high growth segments.• To strategically analyze each submarket with respect to individual growth trend and their contribution to the market• To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market• To strategically profile the key players and comprehensively analyze their growth strategies.
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