Our reports have been revised for market size, forecasts, and strategies to take on 2021 after the COVID-19 impact: https://www.thebusinessresearchcompany.com/global-market-reports

The Semiconductor Assembly And Packaging Equipment Global Market Report 2020-30 by The Business Research Company describes and explains the global semiconductor assembly and packaging equipment market and covers 2015 to 2020, termed the historic period, and 2020 to 2025, termed the forecast period, along with further forecasts for the period 2025-2030. The report evaluates the market across each region and for the major economies within each region.

The Semiconductor Assembly And Packaging Equipment Global Market Report 2021 covers semiconductor assembly and packaging equipment market drivers, semiconductor assembly and packaging equipment market trends, semiconductor assembly and packaging equipment market segments, semiconductor assembly and packaging equipment market growth rate, semiconductor assembly and packaging equipment market major players, and semiconductor assembly and packaging equipment market size.

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The semiconductor assembly and packaging equipment market report provides an in-depth analysis of the impact of COVID-19 on the global semiconductor assembly and packaging equipment industry, along with revised market numbers due to the effects of the coronavirus and the expected semiconductor assembly and packaging equipment market growth numbers 2021-2030.

Semiconductor Assembly And Packaging Equipment Global Market Report 2021 is the most comprehensive report available on this market and will help gain a truly global perspective as it covers 60 geographies. The chapter on the impact of COVID-19 gives valuable insights on supply chain disruptions, logistical challenges, and other economic implications of the virus on the market. The chapter also covers markets which have been positively affected by the pandemic.

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The global semiconductor assembly and packaging equipment market is expected to grow from $11.92 billion in 2020 to $13.44 billion in 2021 at a compound annual growth rate (CAGR) of 12.8%. The market is expected to reach $21.39 billion in 2025 at a CAGR of 12.3%.

The report covers the semiconductor assembly and packaging equipment market segments-
1) By Type: Plating Equipment, Inspection And Dicing Equipment, Wire Bonding Equipment, Die-Bonding Equipment.

2) By Application: Consumer Electronics, Healthcare Devices, Automotive, Enterprise Storage, Others.

3) By End-User: OSATs, IDMs.

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