The increasing usage of semiconductor integrated chips across all the industry domains is immensely boosting the growth of this market. Driven by superior performance capabilities of semiconductor integrated chips. The demand for these chips is very dynamic, across multiple functions. Semiconductors form the foundation of all the electronics that we use in our daily lives. From our alarm to microwave to the cell phone and laptop that enable our workday, most of the things in our surrounding are powered by semiconductor chips. The Internet of Things (IoT) is also one of the major reasons behind the growth of the semiconductor industry.


The Internet of Things (IoT) is transforming the everyday lives of people as it increasingly brings more things into the digital fold. As a result of the growing popularity of smartphones and tablets, some of the first sensors to hit the consumer market were touchscreens and proximity sensors. Today, companies across industries are investing not only in motion and image sensing but also in a variety of ‘smart’ consumer appliances by combining IoT with advanced AI technologies to simulate intelligent behavior and make informed decisions with little to no human intervention. Besides this, with the growth rates for the smartphone market leveling off, the IoT could serve as an important source of revenue, hence represents a major opportunity for semiconductor companies operating in the market. Over the past few years, there has been a spurt in the number of ‘smart’ electronic devices emerging across verticals such as utilities, healthcare, energy and automotive. Beyond the consumer front, enterprises have been advancing their digitization efforts and adopting IoT for better predictability, efficiency, and agility across the supply chain. Increasing penetration of semiconductor chips in the industry fuels the market of semiconductor packaging and assembly equipment. However, the requirement of high investment to open new manufacturing facility in this industry is acting as the major challenging factor for new comers. This is majorly due to the capital intensive nature of the industry. The semiconductor packaging and assembly industry requires high investment in its initial stages and also during research and development stages.


The packaging and assembly methodology can be of several types, namely, Plating, Inspection & Dicing, Wire Bonding and Die-Bonding among others. Among all these, die bonding equipment is anticipated to increase significantly during the forecast period, owing to the increasing demand for semiconductor integrated chips and growing traction of the die bonding segment in the automation in automobiles industry. In the recent years, usage of die bonding for semiconductor chips in airbag control, automatic braking system, Global Positioning System (GPS), power doors & windows, car navigation and display of the cars have increased. As per the application, the semiconductor chips have entered all the possible industries. Some of the major industries deploying highly integrated semiconductor chips include consumer electronics, automotive, healthcare, and industrial sector among others. Among Asian countries, China dominated the semiconductor packaging and assembly equipment market in the Asia-Pacific region. China is anticipated to remain dominant during the forecast period owing to abundant opportunities in the Chinese semiconductor industry.

In addition, growing market for electronics and hardware industry in India, is expected to provide growth opportunity for the players operating in the Indian market. According to a study conducted by The Associated Chambers of Commerce of India (ASSOCHAM) and EY, the Indian electronics and hardware industry is expected to reach US$ 112-130 billion by 2018, majorly driven by the fact that, electronics and hardware manufacturers are looking to increase their manufacturing base in India to cater to the domestic market as well as the Middle East, Africa and SAARC countries.


Furthermore, as per the study conducted by India Electronics & Semiconductor Association, the Indian Electronic System Design and Manufacturing (ESDM) market is expected to grow to US$ 400 billion by 2020, compared to US$ 76 billion industry in 2013. Consumption of semiconductors, in the meantime, has already steadily climbed. According to a study conducted by NOVONOUS, the semiconductor industry in India is estimated to grow from US$ 10.02 billion in 2013 to US$ 52.58 billion in 2020, growing at a CAGR of 26.7%.

Some of the major players profiled in the report include Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group. Over the past few years, these players have adopted numerous competitive strategies, M&A, Strategic alliance, and business expansion among others were the most attractive.

Asia-Pacific Semiconductor Packaging and Assembly Equipment market generated revenue of US$ 2,335.0 million in 2018. The market is expected to grow at a CAGR of 5.6% during the forecast period 2019-2025 to reach a market size of US$ 3,411.1 million by 2025. China dominated the market in 2018 and is expected to remain dominant during the analyzed period, however India is expected to witness highest CAGR growth during the same period.

Table of Contents


1.1 Market Definition 11

1.2 Objective of the Study 11

1.3 Limitation 11

1.4 Stakeholders 11

1.5 Currency used in the Report 12


2.1 Research Methodology for Asia-Pacific Semiconductor P&A Equipment Market 13

2.1.1 Main objective of the Asia-Pacific Semiconductor P&A Equipment Market Study 14


5.1 Introduction 18

5.2 Market Dynamics 19

5.2.1 Market Trend & Drivers 19 Increase in Sales of Smart Phones and Other Smart Consumer Electronic Devices 19 Improved Medical Applications and Equipment 20 Growing Scope in the Internet of Things 21 Increase in Vehicle Automation 23

5.2.2 Market Restraints 23 The requirement of High Investment 23

5.2.3 Market Opportunities 24



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