Processes including micro laser marking, micro laser cutting, micro laser milling, micro surface texturing, thin-film patterning and laser ablation of material are all done with a high-quality laser beam using laser micromachining system.
Laser Skiving is a slicing technique that can be performed on a variety of materials. Laser Skiving can be used to remove specific thin layers off metals without altering the material, exposing the underside for handling, and can also be used to make thin slices on existing substances.
We supply a complete laser micromachining system in India.
- Laser Micro Cutting
- Laser Micro Drilling
- Laser Micro Welding
- Laser Scribing
- Laser Micro Milling
https://www.unitedspectrum.in/16/Laser-Micro-Machining-System
Lasers have been used as a wide variety of tools since inception, which has enhanced our lives in numerous ways.
The microelectronics, aerospace, medical, solar cell, transducer sensor, display manufacturers, and other fields are the ways lasers are used.Lasers offer precision that was previously inaccessible, even from the most skilled experts.
The relentless pace of progress in high-tech industries has resulted in ultrafast picosecond lasers, which have become valuable tools for, particularly high-precision applications.This is because of the unique operating procedure of this form of laser, which allows patterning and clean cutting of sensitive materials and thin films used in many devices and micromachining of delicate materials such as glass.
This replaces conventional cutting and drilling methods in many applications, reducing the use of other elements.Micromachining silicon solar cellsSolar cell producers are working to achieve grid power cost parity in two ways that reduce the cost of cells and improve the efficiency of cell light conversions.Most solar cells are currently based on silicon wafers, and one way to improve the performance of these crystalline silicon solar cells is to use a backside passivation layer to reduce recombination losses.
Holes must be drilled via the passivation layer to allow electrical contacts to the cell.
To maximize the cell output and ensure good ohmic contact for current collection, this must be achieved with minimal damage to the underlying crystalline silicon.For this mission, picosecond laser micromachining offers a low cost, 'direct-write' alternative to photolithography.
