The Radiation Hardened Electronics Market report relies on advanced primary and secondary research methodologies to assess information. The data for the study is gathered from reliable and trustworthy sources, ensuring the authenticity and accuracy of the research study. We also employ qualitative and quantitative analysis to deliver a comprehensive and all-encompassing research study on the global Radiation Hardened Electronics market. The report also comprises of SWOT analysis, PESTLE analysis, and Porter’s Five Forces Model analysis, to offer the reader with a complete and all-inclusive study of crucial segments of the global Radiation Hardened Electronics market.
Increasing use of radiation-hardened electronics in several high-altitude applications is driving market revenue growth. This type of electronics are made of components such as silicon, silicon carbide, and gallium nitride, which are resistant to gamma and neutron radiation and high-energy radiation. These factors drive its adoption in applications such as aircraft, nuclear power plants, and satellites in the form of power supply devices, microprocessors, and switching regulators.
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Top Companies Radiation Hardened Electronics Market and Profiled in the Report are:
BAE Systems, Honeywell International Inc., Renesas Electronics Corporation, STMicroelectronics, Infineon Technologies AG, Microchip Technology Inc., IBM, Data Device Corporation, Cobham Limited, and Micropac Industries, Inc.
Key Highlights of Report
- Commercial-Off-The-Shelf (COTS) segment is expected to register fast growth rate during the forecast period owing to its high bandwidth and improved performance. Increasing demand for high bandwidth in satellite applications is expected to drive its adoption.
- Radiation-Hardening-By-Design (RHBD) segment is expected to register a robust revenue growth rate over the forecast period owing to easy modification, reduced cost per chip, and large-scale production.
- Power management segment is expected to register steady growth rate during the forecast period. Rising demand for metal-oxide-semiconductor field-effect transistor (MOSFETs), which is also known as metal-oxide-silicon transistor (MOSTs) and diodes for several high-end applications in defense and space industries are driving growth of power management.
- Market in Asia Pacific is expected to register high growth rate during the forecast period owing to better economic conditions in countries such as Japan, India, and China coupled with technological advancement in the manufacturing process. In addition, an increasing number of commercial space projects are also driving market growth in this region.
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Objectives of the Report:
- Study of the global Radiation Hardened Electronics market size by key regions, types, and applications with reference to historical data (2017-2018) and forecast (2020-2027)
- Industrial structure analysis of the Radiation Hardened Electronics market by identification of various sub-segments
- Extensive analysis of key market players along with their SWOT analysis
- Competitive landscape benchmarking
- Analysis of Radiation Hardened Electronics market based on growth trends, futuristic outlook, and contribution to the total growth of the market
- Analysis of drivers, constraints, opportunities, challenges, and risks in the global Radiation Hardened Electronics market
- Comprehensive analysis of competitive developments such as expansions, agreements, new product launches, and other strategic alliances
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Emergen Research has segmented global radiation-hardened electronics market on the basis of product type, material type, manufacturing technique, component type, application, and region:
- Product Type Outlook (Revenue, USD Million; 2019–2030)
- Custom Made
- Commercial-Off-The-Shelf (COTS)
- Material Type Outlook (Revenue, USD Million; 2019–2030)
- Silicon
- Silicon Carbide
- Gallium Nitride
- Others
- Manufacturing Technique Outlook (Revenue, USD Million; 2019–2030)
- Radiation-Hardening-By-Design (RHBD)
- Radiation-Hardening-By-Process (RHBP)
- Radiation-Hardening-By-Software (RHBS)
- Component Type Outlook (Revenue, USD Million; 2019–2030)
- Memory
- Logic
- Power Management
- Field-Programmable Gate Array
- Application Specific Integrated Circuit
- Analog & Digital Mix Signals
- Controllers & Processors
On the basis of regional analysis, the market is segmented into the following regions: North America, Latin America, Europe, Asia Pacific, and Middle East & Africa. The market is expected to be dominated by North American nations closely followed by European countries. Asia Pacific is expected to show a significant growth owing to recent advancements and rising investments in the R&D sector.
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