The Molded Interconnect Devices (MID) Market report is a guide that unveils all the necessary information relevant to the market such as value, growth factor, trends, market share, size, and challenges for the forecasted timeline 2022-2028. Further, this report gives a high-level overview of the content present in the report such as segmentation, regional assessment, the smart strategy adopted by major players, and also their market share. In short, the report wraps up all the key points that help to communicate important facets of the market.
The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the molded interconnect devices (MID) market include TE Connectivity, Mitsubishi Engineering-Plastics Corporation, GALTRONICS, Molex LLC, RTP Company, BASF, EMS- Chemie AG, Ensinger, Zeon Corporation, SelectConnect Technologies Suzhou Cicor Technology Co. Ltd (Cicor Group). This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.
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Market Dynamics
The increasing production of 5G antennas using the LDS process significantly contributes to the demand for MIDs. Further, huge prospects are opening up for MID suppliers thanks to the rising demand for IoT devices. The industry's expansion will be aided by the high demand for smart consumer goods like smartphones, laptops, and smartwatches. In addition, the increased need for miniaturisation in the consumer electronics sector and expanding use of these devices in medical equipment is propelling the market. On the downside, the high cost of raw materials used in the fabrication procedures for moulded interconnect devices is one of the main reasons preventing market expansion. Regardless, the market for moulded connection devices will grow due to technological advancement and the growing need to reduce electronic waste.
The research report covers Porter’s Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry’s structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of molded interconnect devices. The growth and trends of molded interconnect devices industry provide a holistic approach to this study.
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Market Segmentation
This section of the molded interconnect devices (MID) market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.
By Process
- Two-Shot Molding
- Laser Direct Structuring (LDS)
- Others
By Application
- Automotive
- Consumer Products
- Healthcare
- Telecommunication & Computing
- Industrial
- Military & Aerospace
- Others
Regional Analysis
This section covers the regional outlook, which accentuates current and future demand for the Molded Interconnect Devices market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.
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According to the new market research report on "Molded Interconnect Device (MID) Market by Process (LDS, 2-Shot Molding, Film Techniques), Product (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting), Industry, and Geography - Global Forecast to 2023", the MID market is expected to reach USD 1,798.3 million by 2023 from USD 894.1 million in 2018, at a CAGR of 15.0% from 2018 to 2023.
Browse 31 market data Tables and 24 Figures spread through 91 Pages and in-depth TOC on "Molded Interconnect Device (MID) Market - Global Forecast to 2023" Download PDF Brochure @ https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=150539319 Early buyers will receive 10% customization on reports.
LDS consists of various steps, such as injection molding, laser activation, metallization, and assembly.
Increasing demand for integrating more electronic circuits into smaller spaces is fueling the growth of LDS in the MID market.
MID miniaturizes devices, which helps reduce the weight of the overall sensor system and increases functionality, resulting in low-cost end-use devices.
In automotive, MID reduces the wiring and combines the connector and housing in 1 piece, and through selective plating, it incorporates all the required circuitry.
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