Global Wafer Inspection Equipment Market Key Developments

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Transparency Market Research (TMR) estimates that the global thin wafer processing and dicing equipment market has a highly consolidative landscape.

Disco Corp. accounted for largest share of 56.4% in 2015 and likely to be dominant in the coming years.

This is creating monopoly in the thin wafer processing and dicing equipment market in terms of competitive presence.

The other key players such as EV Group, Plasma-Therm LLC, Lam Research Corp, Advanced Dicing Technologies, and Tokyo Electron Ltd. are operating in the global thin wafer processing and dicing equipment market.According to TMR, the global thin wafer processing and dicing equipment market is likely to expand at a CAGR of 6.80% over the forecast period to attain a value of US$692.5 mn by 2024-end.

However, North America held the second largest share in the thin wafer processing and dicing equipment market.

Request Sample pages of premium Research Report - https://www.transparencymarketresearch.com/sample/sample.php?flag=B_id=15611Highest Applications in RFID to Propel Market GrowthThe thin wafer processing and dicing equipment market is gaining traction due to the incorporation of microelectronics across consumer electronics.

Wafer Fabrication Equipment MarketThe global wafer fabrication market is expected to grow from USD 50.56 billion in 2018 to USD ~62 billion by 2025, at a CAGR of ~4% during the forecast period.

The process of producing electronic integrated circuits (IC) is complex.

The equipment used for wafer fabrication includes epitaxial deposition equipment, oxidation systems, diffusion systems, ion implantation equipment among others.

Silicon is the most common semiconductor used for wafer fabrication process.

Increasing demand for electronic and electrical devices and the growth of the automotive industry are the major factors contributing to the growth of the global wafer fabrication market.Key playersThe key players in the global wafer fabrication market are Lam Research Corporation (US), SCREEN Semiconductor Solutions Co., Ltd (Japan), Tokyo Electron Limited (Japan), SAMSUNG (South Korea), Applied Materials, Inc. (US), Hitachi High-Technologies Corporation (Japan), Motorola Solutions, Inc (US), Intel Corporation (US), KLA-Tencor Corporation (US), and ASML Holding NV (Netherlands).Other prominent players studied for the global wafer fabrication market are Dainippon Screen Manufacturing Co. Ltd. (Japan), Nikon Corporation (Japan), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Merck KGaA (Germany), and Okmetic Oy (Finland) among others.Regional AnalysisThe global wafer fabrication market is projected to grow at a significant rate during the forecast period from 2019 to 2025.

The geographic analysis of the global wafer fabrication market has been conducted for North America, Europe, Asia-Pacific, the Middle East and Africa, and Central and South America.Asia-Pacific dominated the wafer fabrication market in 2018 due to the presence of major players in countries such as Japan and China.

Rising demand for three dimensional integrated circuit used extensively across various miniature semiconductor devices is one of the important factor anticipated to boost the demand for thin wafer processing and dicing equipment in the coming years.

Three dimensional integrated circuit are increasingly adopted across various space constrained applications including portable consumer electronic devices, sensors, MEMS and industrial products as it increases the overall performance of the products in terms of speed, durability, low power consumption, light weight and memory.

Moreover, three dimensional integrated circuit also helps to reduce the area of consumption in a printed circuit board and in turn enables extensive cost reduction.

Thus, anticipated increasing demand for three dimensional integrated circuit in turn is predicted to boost the demand for thin wafer processing equipment during the forecast period from 2018 - 2025.The report also provides assessment of different drivers that is impacting the global market, along with the restraints and opportunities that are anticipated to affect the demand of thin wafer processing and dicing equipment in the coming years.

Moreover, after taking into consideration all this factors, an extensive analysis of the region wise growth parameters of thin wafer processing and dicing equipment market along with the overall assessment during the forecast period of 2018 - 2025 has been also been furnished within this report.

Furthermore, information relating to the current market trend and future expected market growth of the application, technology and wafer thickness segment across different regions including Asia Pacific, North America, Europe, Middle-East and Africa (MEA) and Latin America is also provided within the report.The major players in the thin wafer processing and dicing equipment market have been profiled competitively across the different broad geographical regions.

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PRODUCT DESCRIPTIONAchieves high cost performance Flexibly supports machinery and systems• High processing performance corresponding to high-speed, high functioning• Variety of extension units flexibly adapting to applications• Realizing servo system with 4 axes of 200 kHz pulse outputThe unit has impressive sequence processing performance for machine control operations, as well as enhanced data process-ing capabilities.

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This contributes to improving production capacity.

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 Global Wafer Cleaning Equipment Market size was valued at US$ 3.64 Bn in 2019 and is expected to reach US$ 6.01 Bn by 2027 to exhibit a CAGR of 6.48% during the forecast period.The objective of the report is to present a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, industry-validated market data, and projections with a suitable set of assumptions and methodology.

The report also helps in understanding the global smart necklace market dynamics, structure by identifying and analyzing the market segments and project the global market size.The report includes an analysis of the impact of COVID-19 lockdown on the revenue of market leaders, followers, and disruptors.

The report also provides PEST analysis, PORTER’s analysis, and SWOT analysis to address questions of shareholders to prioritizing the efforts and investment in the near future to the emerging segment in the global wafer cleaning equipment market.Wafer cleaning is a process of the removal of undesirable particles and chemical contamination from the semiconductor surface, without producing any significant damage to the semiconductor.

This objective can be attained by various technologies like wet chemistry-based cleaning technology, etch cleaning technology, and front side up cleaning technology.Growing electronics and semiconductor industry, increase in conventional applications of micro-electromechanical systems, growth in the number of cleaning steps in the wafer manufacturing industry, rise in the usage of smart devices, integration of new technologies, and increased consumer demand for advanced smartphones and tablets are factors behind the growth of the market.Environmental concerns related to dangerous chemicals and gases generated during the wafer cleaning process are the key factors restraining the growth of the market.

Increasing complexities associated with miniaturized structures of circuits and concerns about compatible materials and toxic chemicals emitted during wafer cleaning is the major challenge to the growth of the market.Increasing demand for silicon-based sensors in IoT and increasing demand for wafers in the 3rd structure generate many opportunities for the global wafer cleaning equipment market.The market for single-wafer spray systems is anticipated to grow at a rapid speed during the forecast period owing to increasing demand for single-wafer spray systems because of their feature that is high precision.

Also, the growing demand for commercial use of LEDs is also driving the progress of the global wafer cleaning equipment market.Also, MEMS manufacturing is expected to hold the largest share of the global wafer cleaning equipment market owing to the growing use of microelectronics cleaning equipment to clean write/read heads of HD drives, printed circuit boards, photomasks, MEMS, silicon wafers, flat panel displays, and complex semiconductor device components.

Wafer Fabrication Equipment Market ReportThe global wafer fabrication market is expected to grow from USD 50.56 billion in 2018 to USD ~62 billion by 2025, at a CAGR of ~4% during the forecast period.

Silicon is the most common semiconductor used for wafer fabrication process.

Increasing demand for electronic and electrical devices and the growth of the automotive industry are the major factors contributing to the growth of the global wafer fabrication market.SegmentationAccording to Market Research Future, the global wafer fabrication market has been segmented on the basis of equipment type, fabrication process, end user, and region.The electronic circuits manufactured using the wafer fabrication process are used for building the required electrical structures of electrical and electronic devices.

Increasing use of fabricated components for in-vehicle infotainment, automobile body electronics, and driver safety systems has also fueled the demand for semiconductor equipment manufactured using the wafer fabrication process in the automotive sector.The global wafer fabrication market has been segmented on the basis of equipment type, fabrication process, end user, and region.Based on equipment type, the global wafer fabrication market has been segmented into oxidation systems, diffusion systems, epitaxial reactors, photolithography equipment, ion implantation equipment, and others.

The ion implantation equipment is the fastest growing segment as it involves the direct introduction of highly energetic, charged atomic species onto the target substrate.

Major players such as Applied Materials, Eaton, and Varian are using ion implantation equipment in their manufacturing processes.By fabrication process, the global wafer fabrication market has been segmented into front end of line processing and back end of line processing.

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