The Semiconductor Assembly And Packaging Equipment Global Market Report 2023 by The Business Research Company, provides semiconductor assembly and packaging equipment market overview across 60+ geographies in the seven regions - Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa for the 27 major global industries. The report covers a ten-year historic period – 2010-2021, and a ten-year forecast period – 2023-2032.
Learn More On The Semiconductor Assembly And Packaging Equipment Market:
According to The Business Research Company’s Semiconductor Assembly And Packaging Equipment Global Market Report 2023, the market size will grow from $10.44 billion in 2022 to $11.82 billion in 2023 at a compound annual growth rate (CAGR) of 13.3%. The Russia-Ukraine war disrupted the chances of global economic recovery from the COVID-19 pandemic, at least in the short term. The war between these two countries has led to economic sanctions on multiple countries, a surge in commodity prices, and supply chain disruptions, causing inflation across goods and services and affecting many markets across the globe. The market size of the global semiconductor assembly and packaging equipment is expected to grow to $18.72 billion in 2027 at a CAGR of 12.2%.
Rising demand for consumer electronics is anticipated to contribute to the growth of the semiconductor assembly and packaging equipment market. Consumer electronics is a key segment that is entirely dependent on the semiconductor industry.
Get A Free Sample Of The Report (Includes Graphs And Tables):
https://www.thebusinessresearchcompany.com/sample_request?id=3687&type=smp
The semiconductor assembly and packaging equipment market is segmented:
1) By Type: Plating Equipment, Inspection and Dicing Equipment, Wire Bonding Equipment, Die-Bonding Equipment
2) By Application: Consumer Electronics, Healthcare Devices, Automotive, Enterprise Storage, Other Applications
3) By End-User: OSATs, IDMs
Technological advancements are a key trend gaining popularity in the semiconductor assembly and packaging equipment market. Major companies operating in the market are focused on introducing new technologies such as compound equipment for better packaging applications. For example, in January 2022, Shengmei Semiconductor equipment (Shanghai) Co., Ltd., a China-based provider of wafer process solutions for semiconductor foreground and advanced wafer-level packaging (WLP) applications, launched a series of integrated equipment to support compound semiconductor manufacturing. The compound semiconductor wet process product line includes gluing equipment, development equipment, photoresist de-gluing equipment, wet etching equipment, cleaning equipment and metal plating equipment, and is automatically compatible with flat edges or notched wafers.
The semiconductor assembly and packaging equipment market report table of contents includes:
1. Executive Summary
2. Semiconductor Assembly And Packaging Equipment Market Characteristics
3. Semiconductor Assembly And Packaging Equipment Market Trends And Strategies
4. Semiconductor Assembly And Packaging Equipment Market – Macro Economic Scenario
5. Semiconductor Assembly And Packaging Equipment Market Size And Growth
.........................
26. Africa Semiconductor Assembly And Packaging Equipment Market
27. Semiconductor Assembly And Packaging Equipment Market Competitive Landscape And Company Profiles
28. Key Mergers And Acquisitions In The Semiconductor Assembly And Packaging Equipment Market
29. Semiconductor Assembly And Packaging Equipment Market Future Outlook and Potential Analysis
30. Appendix
Contact Us:
The Business Research Company
Europe: +44 207 1930 708
Asia: +91 88972 63534
Americas: +1 315 623 0293
Email: [email protected]
Follow Us On:
LinkedIn: https://in.linkedin.com/company/the-business-research-company
Twitter: https://twitter.com/tbrc_info
Facebook: https://www.facebook.com/TheBusinessResearchCompany
YouTube: https://www.youtube.com/channel/UC24_fI0rV8cR5DxlCpgmyFQ
Blog: https://blog.tbrc.info/
Healthcare Blog: https://healthcareresearchreports.com/
Global Market Model: https://www.thebusinessresearchcompany.com/global-market-model
Semiconductor Assembly And Packaging Equipment Global Market Report 2021 by The Business Research Company is the most comprehensive report available on this market and will help gain a truly global perspective as it covers 60 geographies.
The chapter on the impact – both negative and positive – of COVID-19 on the semiconductor assembly and packaging equipment industry gives valuable insights on supply chain disruptions, logistical challenges, and other economic implications of the virus on the market.
This includes revised market numbers according to the effects of the coronavirus and the expected semiconductor assembly and packaging equipment market growth numbers 2021-2030.
View Complete Report:https://www.thebusinessresearchcompany.com/report/semiconductor-assembly-and-packaging-equipment-global-market-report The Semiconductor Assembly And Packaging Equipment Global Market Report 2020-30 by The Business Research Company provides an in-depth analysis of the global semiconductor assembly and packaging equipment market and covers both the historic period, 2015 to 2020, and the forecast period, 2020 to 2030.
The report evaluates the market and major economies across the regions Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.The Semiconductor Assembly And Packaging Equipment Global Market Report 2021 covers semiconductor assembly and packaging equipment market drivers, semiconductor assembly and packaging equipment market trends, semiconductor assembly and packaging equipment market growth rate, semiconductor assembly and packaging equipment market major players, player-adopted strategies in the market, and semiconductor assembly and packaging equipment market size.The global semiconductor assembly and packaging equipment market is expected to grow from $11.92 billion in 2020 to $13.44 billion in 2021 at a compound annual growth rate (CAGR) of 12.8%.
The growth is mainly due to the companies rearranging their operations and recovering from the COVID-19 impact, which had earlier led to restrictive containment measures involving social distancing, remote working, and the closure of commercial activities that resulted in operational challenges.
Market Research Future (MRFR) report on Semiconductor Assembly and Testing Services (SATS) market (2016-2022) discusses and analyses the effect of the Covid-19 outbreak on the semiconductor assembly and testing services (SATS) industry, including future opportunities and threats, drivers, and risks.
Semiconductor assembly & testing services (SATS) can be referred to as a cloud service that needs less maintenance and easier application development.
Electrification and automation of automobiles are contributing to a growing need for semiconductor assembly and testing.
These factors are anticipated to accelerate the global Semiconductor Assembly and Testing Services (SATS) market over the forecast period.
Key Players The key participants identified by MRFR in this market are Advanced Semiconductor Engineering, Inc. (U.S.), Powertech Technology Inc. (Taiwan), Amkor Technology, Inc. (U.S.), Siliconware Precision Industries Co., Ltd. (Taiwan), STATS ChipPAC Ltd (Singapore), CORWIL Technology (U.S.), Chipbond Technology Corporation (U.S.), Integrated Micro-Electronics, Inc. (U.S.), Global Foundries (U.S.).
In 2013, Amkor Technology, Inc. acquired Toshiba Electronics Malaysia to improve cost competitiveness and expand assembly operations.
