Broad Ion Milling Comprehensive Study by Type (Cross-Section Milling, Flat Surface Milling), Application (Semiconductor Manufacturing, Geological Institutes, Forensic Laboratories, Medical Research Institutes, Food Analysis, Others), Electron Microscopy (Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Focused Ion Beam (FIB)), Sample material (Ceramics, Polymers, Composites, Metals, Other) Players and Region - Global Market Outlook to 2025 AMA Research recently released a comprehensive study of 150+ pages on Broad Ion Milling market with detailed insights on growth factors.
Post covid scenario and competitive strategies.
The study segments key regions that includes North America, Europe, Asia-Pacific with country level break-up and provide volume* and value related cross segmented information by each country.
Some of the important players from a wide list of coverage used under bottom-up approach are Veeco Instruments Inc. (United States) Leica Microsystems GmbH (Germany) Hitachi High-Technologies Corporation (Japan) Gatan, Inc. (United States) Intlvac Thin Film Corporation (United States) AJA International Inc. (United States) Nano-Master, Inc. (United States) Nordiko Technical Services Ltd. (United Kingdom) Scia Systems GmbH (Germany) Technoorg Linda Co. Ltd. (Hungary) Broad ion milling is a method of sample preparation which complements and significantly extends the capabilities of the traditional microscopy and metallographic laboratories.
This method uses high-energy argon ion bombardment to remove material or modify the surface of a sample.
The broad ion milling has various applications such as preparation of cross sections of semiconductors, removal of contamination films, removing thin plating layers, and others.