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How Assemblers Use X-Ray Inspection for BGA - Blog

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Katy Radcliff
How Assemblers Use X-Ray Inspection for BGA - Blog

X-ray inspection of BGA is becoming the more popular and important process in the Electronics Manufacturing Industries. However, there are two techniques, which is used in combination with one another that reduce the number of defects which "pass" and are noted during the BGA inspection process. BGA X-rays inspection gives other x-ray inspection capabilities such as Void detection and percentage calculation, Wire bond analysis, Short circuit analysis etc. In order to know how assemblers use X-Ray inspection for BGA’s, visit this blog.

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Katy Radcliff
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