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The Modern Rules of Femtosecond Laser Micromachining

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Laserod Wafer
The Modern Rules of Femtosecond Laser Micromachining

Laser micromachine is now a viable method of surface alteration and machining. Some recent developments in the advancement of femtosecond lasers are explored along with a brief overview of a variety of prominent emerging applications in industrial and medicine that support access to these sources:

Using a broad range of wavelengths, waveforms, and pulse durations; For example, the average beam power at 343 nm with a mode lock is 4w at 25a, and the pulse duration at the oscillator output is 500 fs. Also, it can be extended to a variety of materials.

Femtosecond lasers currently show much promise as potential sources of choice in a number of laser micromachining applications. This includes biomedicine, photonics, and semiconductors. Femtosecond lasers are presently being considered for a growing range of micromachining applications with their potential to handle any substance with a minimum amount of heat-affected zones and haz.

It is a maskless technology that allows rapid device prototyping and has fundamental three-dimensional capabilities. It is the main reason for the use of femtosecond pulse lasers in the precise micromachining. The most accurate bulk geometric modification is achieved by the use of ablation via the application of short wavelengths to deliver massive photons for absorption in micromachining of ceramics; also, zirconia and aluminum carbide are widely used in the mems devices.

New applications and advancement in femtosecond laser technologies are currently very promising as ideal sources of choice for a range of femtosecond micromachining. Laserod Technologies LLC is committed to offering outstanding micromachining services to a range of sectors, including micro-electronics, aerospace, and medical. We also provide top micromachining services in the solar, transducer, touchscreen manufacturers, and other industries.

Laserod's specialties include the drilling and cutting of thin materials, small hole drilling, resizing or cutting of silicon wafers, trimming of hybrid resistor circuits, cutting of ceramic substrates and circuit patterning on displays such as ITO on glass and PET. For more information and project inquiries, call our experts at 310-340-1343/ 888-991-9916.

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