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How the Wafer Front End and 300mm FOUP can help increase productivity?

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Kensington Laboratories
How the Wafer Front End and 300mm FOUP can help increase productivity?

Are you looking for leading-edge robotic automation?

One must know that the wafers in a 300mm semiconductor fabrication facility are conveyed via the workshop I carriers, which are recognized as front opening unified pods (FOUPs).

Visit now at https://bit.ly/2MDFuqP

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Kensington Laboratories
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