Market Overview:
Market Research Future (MRFR), in its latest report on the Globally, the High-Density Interconnect (HDI) Printed Circuit Board (PCB) Market 2020, states major factors that are expected to boost the expansion of the market across the study period. An in-depth analysis of the impact of coronavirus outbreak on the High Density Interconnect PCB Market is provided along with the report. As per MRFR analysis, the worldwide market of High Density Interconnect PCB is expected to rise at 12.4% CAGR across the analysis period 2018–2013. High Density Interconnect PCB value can touch USD 15,600.6 Mn from USD 8,683.9 Mn in 2018 to 2023.
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High Density Interconnect PCB Market – Segmentation
The MRFR report highlights an inclusive segmental analysis of the global High Density Interconnect PCB Market based on industry vertical and the number of high-density interconnection layer.
By number of high density interconnection layer, the global high density interconnect PCB market is segmented into 1, 2, & all.
By industry vertical, the global high density interconnect PCB market is segmented into medical devices, manufacturing, automotive, telecom and IT, military and defense, consumer electronics, and others. Of these, the automotive segment will lead the market over the forecast period.
Key Players
FINELINE Ltd. (Israel), SIERRA CIRCUITS, INC. (US), Advanced Circuits (US), TTM Technologies (TTMI) (US), Epec, LLC (US), PCBCART (China), RAYMING (China), Millennium Circuits Limited (US), Mistral Solutions Pvt. Ltd. (India), FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan), and Austria Technologie & Systemtechnik Aktiengesellschaft (Austria) are some reputed companies functioning in the HDI PCB Market, sorted by MRFR.
High Density Interconnect PCB Market – Regional Analysis
Based on the region, the global high density interconnect PCB market report covers the growth opportunities and recent trends across the Asia Pacific (APAC), North America, Europe, & the Rest of the World (RoW). Of these, North America will spearhead the market over the forecast period. The use of innovative technologies in semiconductors, the booming consumer electronics industry, the presence of leading manufacturers, and growing demand from consumer electronics and automotive industry is adding to the global high density interconnect PCB market growth in the region. The US holds the utmost share in the market.
The global high density interconnect PCB market in Europe is predicted to have sound growth over the forecast period. Increasing joint ventures, acquisitions, and mergers among international players is adding to the global high density interconnect PCB market growth in the region.
The global high density interconnect PCB market in the RoW is predicted to have steady growth over the forecast period.
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About Us:
Market Research Future (MRFR) is an esteemed company with a reputation of serving clients across domains of information technology (IT), healthcare, and chemicals. Our analysts undertake painstaking primary and secondary research to provide a seamless report with a 360 degree perspective. Data is compared against reputed organizations, trustworthy databases, and international surveys for producing impeccable reports backed with graphical and statistical information.
Market SynopsisMarket Research Future (MRFR), in its latest report on the Globally, the High-Density Interconnect (HDI) Printed Circuit Board (PCB) Market 2020, states major factors that are expected to boost the expansion of the market across the study period.
An in-depth analysis of the impact of coronavirus outbreak on the high density interconnect PCB market is provided along with the report.
As per MRFR analysis, the worldwide market of High Density Interconnect PCB is expected to rise at 12.4% CAGR across the analysis period 2020–2027.
High Density Interconnect PCB value can touch USD 15,600.6 Mn from USD 8,683.9 Mn in 2020 to 2027.The growing awareness about the higher circuitry density of HDI PCB over traditional PCB that allows designers to fit more components on an HDI PCB is expected to underpin the expansion of the market in the years to come.
Features, such as shorter distance between electronic components and their compactness aid in the reduction of signal loss and crossing delays that result in the rapid transmission of signals.
The industry vertical based segments of the High Density Interconnect PCB Market are military and defense, consumer electronics, automotive, telecom and IT, medical devices, manufacturing, and others.
< a href="https://www.maximizemarketresearch.com/market-report/global-high-density-interconnect-hdi-pcb-market/30122/"> Global High-Density Interconnect (HDI) PCB Market was valued US$ 9.58Bn in 2017 and is expected to reach US$ 23.53 Bn by 2026 at a CAGR of 11.89% during the forecast period.Global High-Density Interconnect (HDI) PCB MarketThe factors that drive the global HDI PCB market include miniaturization of size and lower weight, high efficiency, and growing sales of consumer electronics.
Currently, application of these boards in consumer electronic devices like smartphones, smart wearables, gaming consoles, tablets, and others are significant.
These attributes contribute to the high performance and lightweight of HDI boards that make them ideal for powering wearable devices.Asia Pacific expectedto account for the major share of the global HDI market in during the forecast period.
It is also because of the extension of telecommunications networks in China, South Korea, India, and other developing countries in Asia Pacific.The company believes in providing leading-edge products for the growth of HDI PCB market.
For this purpose, Unimicron has developed partnerships with Tier 1 materials and equipment suppliers.
The company participates in product and technology development projects in domestic and international research institutes; there are cooperative projects with research institutes like IZM (Germany) and Georgia Institute of Technology.This study presents an analytical depiction of the global HDI PCB market along with the current trends and future estimations to depict the imminent investment pockets.
