Sputtering is a high-rate vacuum coating technique that allows the deposition of various materials, including metals and ceramics using a specially formed magnetic field. Magnetron sputtering employs plasma to generate ions which bombard the surface of a ‘target’ which then sputters thin film material on to a substrate. HHV offers a range of circular and linear magnetron sputter sources, engineered to meet R&D and production requirements. It belongs to the PVD family of processes.
Ion beam sputtering uses an ion source to sputter target material to deposit thin films onto a substrate. This process allows for depositions to be carried out at better vacuum ranges resulting in films with improved adhesion, dense film structure, less defects, higher purity, and better controlled composition HHV offers ion beam sputtering systems for R&D and production applications.
Sputtering Procedure:
Once vacuum is created in the coating chamber plasma generation is initiated. Using either an RF or DC power supply high voltage is applied to the cathode and anode which create a charged gas that begins to displace electrons from the charged gas. This phenomenon is called ionization. This differential charge causes the positive atoms in the gas to move towards the cathode. The cathode is normally located behind the sputtering target. The charges gas collides with the target causing atoms from the target to get ejected at a high energy. The sputtering gas used is normally argon, oxygen or nitrogen.
Magnets confine the electrons in the plasma through a field near the target surface which improves plasma density and increases the rate of deposition. It also prevents the electrons from damaging the growing thin film on the substrate.
It is possible to deposit multi-materials on a substrate in a single vacuum process. HHV employs RF and DC sputtering in a class 1000 clean room. HHV does metallic and non-metallic sputtered coatings. The vacuum chambers Sputtering takes place at normal temperatures and pressures (10.1 – 10.3 mbar), although it is required to begin at a lower pressure before adding Argon to minimize contamination from remaining gases. It is possible to deposit different thicknesses, especially alloys, in a single run because of the variety of sputtered target geometries (round, oblong, Delta, tubular etc.) and materials employed.
About Company:
Hind High Vacuum (HHV) is India’s premier thin film and vacuum technology company, with over 55 years of expertise in the design and manufacture of high vacuum equipment for research and industrial applications.
For more information about Sputtering System visit our website: https://hhv.in/
Contact us:
Site No. 17, Phase 1, Peenya Industrial Area, Bengaluru – 560058, India Phone: +91-80-41931000
Fax: +91-80-28394874
Email: [email protected]
9th October, 2018 - Vacuum Heat Treatment Market is expected to witness lucrative growth over the forecast period.
The factors contributing to the market growth includes increasing demand from automobile industry, growing copper and steel industries and need for hardening dissimilar materials.
In addition, adaptation of internet of things is the factor contributing to the growth in coming six years.Request a Sample Copy of This Report @ https://www.millioninsights.com/industry-reports/vacuum-heat-treatment-market/request-sampleGrowing copper and steel industries is estimated to be the major factor driving market growth.
The demand for copper is increasing owing to the increasing investment in the construction industry which consumes copper in large quantity.
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In this industry, vehicles manufacturing involves use of various components such as piston mills, gears, flywheels and camshaft made from metals including iron, steel, aluminum and other alloys.
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