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Application and protection of hydrofluoric acid in wafer fab

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Nanjing Binglab
Application and protection of hydrofluoric acid in wafer fab

https://www.njbing-lab.com/application-and-protection-of-hydrofluoric-acid-in-wafer-fab/


Hydrofluoric acid, this highly toxic liquid is actually used in the production of wafers, which may surprise you. In fact, hydrofluoric acid, a seemingly ordinary clear liquid, actually plays a crucial role in chip production.

What is the nature of hydrofluoric acid?

Hydrofluoric acid, chemical formula: HF, is an aqueous solution of HF gas.

Physical properties: Hydrofluoric acid is a colorless liquid with a strong pungent odor. Boiling point 19.5 degrees Celsius, volatile.

Chemical properties: Hydrofluoric acid is a weak acid. Unlike most acids, HF does not react with all metals, such as aluminum and magnesium. However, the fluorine element in hydrofluoric acid is extremely reactive, which allows fluorine to form stable compounds with many elements. It can react with most oxides to form the corresponding fluorides, including some insoluble oxides such as aluminum oxide and silicon oxide. The chemical formula is:

SiO 2 + 6 HF → H 2 SiF 6 + 2 H 2 O

Al2O3 + 6HF → 2AlF3 + 3H2O

Si + 4HF -> SiF4↑ + 2H2O

Danger: Unlike other acids, HF can penetrate deep into the skin until it penetrates into the bone. When HF comes into contact with the skin, it can quickly penetrate the skin and tissues and destroy cells. Fluoride ions are highly electrophilic, and they will combine with calcium ions and magnesium ions in the body to form insoluble calcium fluoride or magnesium fluoride precipitates. This interferes with nerve conduction and muscle function, and may even cause the heart to stop.

Application of hydrofluoric acid in chip production

Cleaning effect: Silicon forms a silicon oxide (SiO2) layer when exposed to air. This layer of silicon oxide needs to be removed during many process steps, such as before the heat treatment process. Hydrofluoric acid is the only chemical that can effectively clean silicon oxide on the surface of silicon wafers. Hydrofluoric acid can react with SiO2 to generate volatile fluorosilicic acid, thereby removing the oxide layer on the surface of the silicon wafer.

Wet etching: Hydrofluoric acid is a commonly used etching liquid in wet etching. Wet etching is the process of removing surface material through a chemical reaction. In some processes, wet etching is required to form the desired structure. Hydrofluoric acid can be used to etch silicon and some silicon compounds.

Hydrofluoric acid protection?

  1. When working, you must wear acid-proof clothing, acid-proof gloves, and acid-proof and splash-proof masks or goggles. Handling hydrofluoric acid should be carried out under well-ventilated conditions, preferably under a chemical extraction hood.
  2. Emergency showers and eyewash facilities should be provided in the work area and should be checked regularly for proper functioning.
  3. Personnel working with hydrofluoric acid should receive appropriate chemical safety training on how to properly handle and store hydrofluoric acid, and how to respond in the event of an accident.
  4. Hydrofluoric acid should be stored in corrosion-resistant, ventilated and leak-proof cabinets. Additionally, hydrofluoric acid should not be stored in glass containers.


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